MLAb

MLAb performs cold laser ablation to define ultra-precise apertures and micro-features in a single-step controlled process. The system maintains micron-level accuracy and repeatability without inducing thermal distortion in the base material, eliminating constraints on feature size, spacing and geometry.

This technology displaces electroforming and other multi-stage methods with a digitally controlled, low-energy, chemical-free process with no environmental impact.

MLAb delivers the precision required for fine component geometries such as 006003 and supports the fabrication of advanced semiconductor packaging, micro-LED, ball drop and cap stencil applications.

Integrated closed-loop process control ensures dimensional stability and process consistency, while advanced AOI and high-accuracy depth measurement provide continuous verification for repeatable, production-grade results.