Glass Processing
Process: Ablation
Fast, clean and precise.
Fast, clean and precise laser processing of glass without inducing cracks or thermal stress.
Ultra-short Pulse Lasers
Only possible using ultra-short pulse lasers capable of sub-micron precision and non-thermal material removal.
Precision Glass Processing with Ultra-Short Pulsed Lasers
Glass is increasingly used in advanced electronics, sensors and optical systems but it remains one of the most difficult materials to process using conventional methods. Mechanical tools cause edge chipping, cracking and contamination, while chemical etching is slow, hazardous and difficult to control. Ultra-short pulsed laser processing overcomes these challenges by removing material through direct ablation, not heat. This allows drilling, cutting and patterning with sub-micron precision and no thermal damage.
Using femtosecond and picosecond laser systems, features such as through-glass vias (TGVs), micro-channels and optical apertures can be produced rapidly and repeatably. The process delivers exceptional edge quality and tight dimensional control, making it ideal for wafer dicing, sensor windows and display glass shaping.
For customers, this translates to higher yield, cleaner parts and reduced downstream polishing or cleaning. For manufacturers, it opens new design freedoms, enabling thinner substrates, tighter packaging and integration of glass in places previously limited to ceramics or plastics.
Declan Brannagan
Project lead
Why it matters?
Glass is a critical material in next-generation electronics and optics, yet conventional machining methods limit what’s possible. Mastering laser-based glass processing opens access to high-value markets such as advanced packaging, automotive sensors and medical devices where demand for precision, cleanliness and yield are rapidly increasing.
Speak to our team today
We’d love to chat to you about our laser solutions and how we can work together.