Monolithic Laser Ablation

Watt Laser’s Monolithic Laser Ablation (MLAb) revolutionises laser processing by leveraging ultra-fast, ultra-short pulsed lasers. Through true ablation, material is removed by high-energy pulses, foregoing a liquid transition and converting solid material directly into gas. This cold process leaves behind clean, exact cuts achieved with unparalleled speed, precision and repeatability.

Engineered to replace electroforming in the semiconductor packaging industry, MLAb sets a new standard as the premier solution for high-end semiconductor packaging tooling.

High-Speed 2D Galvo Scanner – The laser is positioned using ultra-fast scanning mirrors, significantly reducing processing time.

Closed Loop Depth Control – Feature depth can be measured using a high-accuracy Z-Sensor with a resolution of 25nm, and corrected if required, down to an accuracy of 1μm. 

Advanced AOI – Fully integrated inspection process, with all QC100 features and capabilities.

Multiple Material Processing – All metals such as Steel, Aluminium, Copper, Nickel, Gold; as well as, Ceramics and Polymers such as Polyamide.

Cold Ablation – Processing materials through cold ablation allows for minimal heat transfer with zero material distortion. This enables aperture proximity to be reduced to 15μm. 

Formation of Intricate Features – Material is removed in a controlled manner, allowing for the formation of intricate features, such as 3D pockets and apertures, with feature sizes down to 60um, on ultra-thin materials.

No Harmful Chemicals. Zero chemicals required. Zero chemical waste. 

Reduced Space Between Apertures. Enables more dense, more complex stencil designs.

Simplicity of Process. Simply load the stencil and files. Process is streamlined and automated.

Superior Quality. Cold ablation ensures a smooth aperture side wall with zero laser burr. This creates superior surface flatness and side wall finish.

Higher Accuracy and Repeatability. Consistent high-quality results.

Faster and More Cost-Effective. Reduced production time and overheads.